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  2. Corsair's upcoming MP600 SSDs are now available to preorder. Today's SSDs are fast, but upcoming models that can leverage the PCI Express 4.0 bus kick things up a notch, with sequential read speeds rated at around 5,000MB/s. What about cost? Preorder pricing for Corsair's Force Series MP600 SSDs offers some clarity on the subject. Over on Amazon, Corsair's MP600 is now listed at $249.99 for the 1TB model and $449.99 for the 2TB model. Pricing and capacity eluded Corsair's MP600 unveiling last month, but now we know. Compared to our roundup of the best SSDs for gaming, Corsair's new drives are competitively priced with today's fastest SSDs. You're looking at around $0.25 per gigabyte for the 1TB model and $0.22 per gigabyte for the more capacious 2TB model. Here's how those prices stack up to some of the higher performing, current-generation alternatives: Samsung 970 Evo Plus 1TB—$217.99, Amazon Samsung 970 Evo Plus 2TB—$488.89, Amazon WD Black SN750 1TB—$215.99, Amazon WD Black SN750 2GB—$529.99, B&H Photo Some of those are sale prices, such as the 1TB Samsung 970 Evo Plus—its MSRP is $249.99, same as Corsair's upcoming MP600. There are far cheaper alternatives, of course, particularly in the realm of SATA SSDs where a 1TB model can be under for under $100 these days. However, Corsair's pricing on its newfangled PCIe 4.0 SSD line is surprisingly in line with today's best performing NVMe SSD models. Not that you need a PCIe 4.0 SSD for gaming. In Corsair's case, the MP600 is rated to deliver up to 4,950MB/s of sequential read performance. Samsung rates its 970 Evo Plus at 3,500MB/s for the 1TB model, and the WD Black SN750 is not far behind at 3,470MB/s. The fastest SATA models typically top out at around 550-580MB/s. The added speed of an NVMe SSD, whether it's a PCIe 3.0 model or an upcoming PCIe 4.0 model, is largely wasted for gaming. For some tasks, however, there is a tangible benefit to having faster file transfers (moving around large video files, for example). One thing to keep mind is that you'll need a PCIe 4.0 motherboard to fully leverage a next-gen SSD, otherwise you'll never hit those rated ~5,000MB/s speeds. As of right now, that means planning a build around a third-generation Ryzen processor and X570 motherboard. Both of those will be available next month. Source
  3. ajdibi

    ESET BETA 12.2.19.0

    @boulawan Can you upload v12.2.19.0 to a host please, as the download links in your post link to v12.1.34.0.
  4. SwissMiss

    The Final Countdown #7 Continue

  5. This is not a requesting thread! Topic closed pending review.
  6. I can't get "RePack_KRT_CLUB_3.1.0.29_ATB_En_Final_v2" to work. I get malware alert and have to disinfect my pc. Anyone have same issue? Screenshot:
  7. Many years ago, when the Surface brand was just getting started, Microsoft was using Intel and ARM-based chips for its products. While the long-term winner was Intel, as they have been supplying the chips for all Surface devices for the past couple of years, that may change, starting this fall. This fall, it is expected that Microsoft will host an event with Surface at the focus. The company will announce updates to its products but the bigger changes may be under the hood, rather than physical appearance. In previous years, we had seen Microsoft make bets on upcoming Intel chips with Cherry Trail and Skylake. With Skylake, Microsoft got burned by the immaturity between Windows and the chips which resulted in faulty hardware and a serious black eye to the brand’s high-quality reputation. Even though Microsoft and Intel have worked together for decades, insiders at Microsoft have described that the company’s relationship with Intel as being on shaky ground. And when it comes to next-generation devices, look for the company to start to diversify away from a purely-Intel lineup. This means a move to testing the waters with AMD and an ARM chip; the company currently has prototype devices using these types of components. On the laptop side, Microsoft is experimenting with using an AMD Picasso SoC which is of the 12nm flavor for a variant of their Surface Laptop. On the Pro side, Microsoft currently has prototypes of a Surface Pro with a Snapdragon chip inside as well. The Pro device with an ARM chip inside is a device that is being developed on-campus in Redmond. Previous devices, like the Surface Go, are sometimes outsourced to ODM (Original Device Manufactures). The interesting bit about the ARM Pro is that Microsoft is developing a custom SoC code-named Excalibur. Unlike previous attempts with ARM, I am told that Microsoft worked extremely closely with Qualcomm to build this chipset, based on their own specifications, to design a chip that would work better with Windows 10. This new SoC may be used as a reference device for other OEMs who are looking to use the 8cx (or similar) in upcoming products. But the company isn’t going to drop fully drop Intel; the brand power behind the Intel name will still help to move hardware and the company will have new flavors of the Book, Pro, and other devices that still using chips from that manufacturer. Such as the Pro 7, which will retain a similar design to the Pro 6 but will finally include a USB-C port, I don’t expect it to include Thunderbolt 3. Microsoft has a redesigned Surface Pro device code-named Carmel that does feature an updated look that was previously expected to launch this year. Insiders at the company are saying that this design has been punted until next year. Earlier this week, Forbes posted what they believed will be the specs for the upcoming Centaurus device. The hardware, which features two displays that are connected with a hinge, has multiple configurations currently, some have an ARM processor but others are based on Intel. While Microsoft could show off the device, I don’t expect it to ship this year and further, the business justification for the hardware has yet to materialize; Microsoft doesn’t yet have a compelling reason to sell the device. One thing that is clear, Microsoft needs to show leadership in the ARM space with its own first-party hardware and with the 8cx becoming commercially available this fall, if Microsoft doesn’t ship a device with the chip, or a derivative of the chip, why would anyone take this new attempt to ship Windows-on-ARM seriously? In October, Microsoft is targeting a hardware event that will likely include new Surface goods but there may also be a software story to tell. The company’s ‘Teams for Life’ or the consumer version of Microsoft 365, may also make an appearance around this time. Source
  8. Exclusive: FAA says it identifies new potential risk on 737 MAX WASHINGTON (Reuters) - The U.S. Federal Aviation Administration has identified a new potential risk that Boeing Co must address on its 737 MAX before the grounded jet can return to service, the agency told Reuters on Wednesday. FILE PHOTO: The angle of attack sensor, at bottom center, is seen on a 737 Max aircraft at the Boeing factory in Renton, Washington, U.S., March 27, 2019. REUTERS/Lindsey Wasson/File Photo The risk was discovered during a simulator test last week and it is not yet clear if the issue can be addressed with a software upgrade or will require a more complex hardware fix, sources with knowledge of the matter told Reuters. The FAA did not elaborate on the latest setback for Boeing, which has been working to get its best-selling airplane back in the air following a worldwide grounding in March in the wake of two deadly crashes within five months. The new issue means Boeing will not conduct a certification test flight until July 8 at the earliest, the sources said, and the FAA will spend at least two to three weeks reviewing the results before deciding whether to return the plane to service. Last month, FAA representatives told members of the aviation industry that approval of the 737 MAX jets could happen as early as late June. The world’s largest planemaker has been working on the upgrade for a stall-prevention system known as MCAS since a Lion Air crash in Indonesia in October, when pilots were believed to have lost a tug of war with software that repeatedly pushed the nose down. A second deadly crash in March in Ethiopia also involved MCAS, together killing 346 people. “On the most recent issue, the FAA’s process is designed to discover and highlight potential risks. The FAA recently found a potential risk that Boeing must mitigate,” the FAA said in the statement emailed to Reuters. “The FAA will lift the aircraft’s prohibition order when we deem it is safe to do so.” Asked about the new potential risk, Boeing said it is “working closely with the FAA to safely return the MAX to service.” Boeing’s aircraft are being subjected to intense scrutiny and testing designed to catch flaws even after a years-long certification process. Two people briefed on the matter told Reuters that an FAA test pilot during a simulator test last week was running scenarios seeking to intentionally activate the MCAS stall-prevention system. During one activation it took an extended period to recover the stabilizer trim system that is used to control the aircraft, the people said. It was not clear if the situation that resulted in an uncommanded dive can be addressed with a software update or if it is a microprocessor issue that will require a hardware replacement, but Boeing has told the FAA it believes the issue can be addressed with a software upgrade. A hardware fix could add new delays to the plane’s return to service. The FAA also said on Wednesday that it continues “to evaluate Boeing’s software modification to the MCAS and we are still developing necessary training requirements. We also are responding to recommendations received from the Technical Advisory Board. The TAB is an independent review panel we have asked to review our work regarding 737 Max return to service.” American Airlines Group Inc and Southwest Airlines Co earlier canceled flights through early September as a result of the grounding. On Wednesday, United Airlines said it also was removing Max flights from its schedule through Sept. 3. Source: Exclusive: FAA says it identifies new potential risk on 737 MAX
  9. PetaOctet

    The Final Countdown #7 Continue

  10. Jordan

    Lucky Patcher 8.5.1

    Topic closed for not respecting one of our most known basic rules!!!
  11. Naveed Sherwani, chief executive officer of fabless semi company SiFive, has claimed that there'll be smartphones and servers on the market powered by the RISC-V instruction set architecture (ISA) within the next five years. One of a number of entries in the free and open source silicon (FOSSi) movement, the open RISC-V ISA has been making serious headway in moving off the drawing board and into actual shipping products: Western Digital ships RISC-V-based cores in its storage processing products, it can be found in solid-state storage controllers, many-core accelerators for artificial intelligence work, Synaptics human-interface devices, and while Nvidia has been using it for logic chips in the past the company has recently telegraphed a deeper interest in the technology. Designed to scale from ultra-low-power implementations for embedded designs all the way up to exascale supercomputers, RISC-V has industry incumbents worried: RISC-V pioneer SiFive has enjoyed investment from Intel in a keep-your-enemies-closer move while Cambridge-based Arm, having failed to scare potential users away from the ISA, released its own free-as-in-beer cores to compensate. At the moment, though, while RISC-V chips may lurk in SSDs, trackpads, and smartwatches, getting a non-embedded RISC-V device isn't straightforward. SiFive is at the forefront, here: The company released a 1.5GHz development board capable of booting mainstream Linux back in February 2018, following on from its HiFive1 Arduino-like embedded development board. Now, SiFive chief executive Naveed Sherwani has made a bold prediction: Off-the-shelf RISC-V servers and smartphones to appear within the next five years. Previously, Sherwani had predicted that RISC-V-based smartphones would arrive within the next five years and servers would follow in around 10. This prediction has now been revised, according to an interview with Data Center Knowledge, pulling servers down to the same five-year time frame owing to the rate of adoption and interest from the industry - in particular Qualcomm, which has dabbled with Arm-based server chips in the past and recently invested in SiFive through its Qualcomm Ventures arm. Specifically, Sherwani claims that RISC-V 'cellphones and laptops are two years, and servers are five years away - that is how much it has changed in the last year [since the previous prediction].' The pull-in of the smartphone target follows the US placing a trade embargo on Chinese telecoms giant Huawei banning it from using any technology from US companies; while the embargo would also prevent it from using parts from SiFive, it would be free to produce its own RISC-V designs through its HiSilicon fabless semiconductor subsidiary. The launch of a novel instruction set architecture into an established market isn't altogether straightforward, however. Intel's delayed entry into the smartphone and tablet market proved an abject failure when popular Android software written with the Arm architecture in mind failed to work correctly on the company's x86-based Atom processors; numerous attempts to bring Arm into the data centre, by contrast, have also fallen by the wayside - including one effort by AMD. Where RISC-V has an edge, however, is in its open nature: Anyone is free to see, implement, and even sell designs based on the RISC-V ISA, and some implementations are also provided under permissive licences for immediate re-use with no royalties or license fees; this stands in stark contrast to both x86 and Arm, which are jealously-guarded proprietary ISAs. Source
  12. SiFive bets open-source chips will win over Chinese clients looking to avoid US clampdown PALO ALTO, U.S. -- American chip startup SiFive sees an opportunity to gain ground in China amid the intensifying trade war by offering an open-source alternative for chip design that could help reduce the country's reliance on Western technology. The California-based company provides design services for chips, such as those used in mobile devices and storage centers, based on the RISC-V chip architecture. Because RISC-V is open source -- meaning anyone in the world can access it freely -- Chinese companies increasingly see it as a potential alternative to global chip leaders Intel and Arm Technologies for powering their devices. This is particularly important as Washington steps up its restrictions on exports of U.S. technology to China. In May the U.S. Commerce Department placed Huawei Technologies on its so-called Entity List, which bars American companies from transferring technology to it without a special license. Five more Chinese companies were recently added to the list. These restrictions, however, do not apply to open source technology, according to Kevin Wolf, a former U.S. Assistant Secretary of commerce and partner at law company Akin Gump. "Technology that is 'published' and openly accessible is not subject to the Export Administration Regulations and thus not affected by Entity List prohibitions," Wolf said. Because the RISC-V chip architecture falls under the "published" category, it could serve as a potential chip alternative for Huawei -- though the company has indicated it will continue using Arm-based chips in its devices for the time being. SiFive was founded in 2015 by three academics at the University of California, Berkeley who originally developed RISC-V. While anyone, in theory, can use RISC-V to design chips, doing so is extremely time consuming and costly. SiFive makes money by offering cloud-based design services that simplify the process. SiFive President and CEO Naveed Sherwani, an ex-Intel chip developer and industry veteran who joined the company in 2017, says it is perfectly positioned to grow. "We are going to expand big time in China. The trade war has helped us a lot because it convinced China to do more chips inside the country and we are helping them do so," Sherwani said. "It became clear to us about three or four years ago that a trade war is going to happen," Sherwani said, "and the action we took is building a completely independent company in China." That company is SiFive China, in which SiFive holds a less than 20% stake. That small share, will be diluted as more outside funding comes in, means SiFive does not have to report the Chinese company's financials in its own earnings, and SiFive China is treated as an independent company by U.S. regulators. SiFive provides its counterpart in China with intellectual property related to its design services. "I think there is a common misunderstanding in the market that the U.S. Entity List is a blanket ban, like a wall between U.S. and China, but it's not. It's more like a gate, there are things allowed through and there are things not," Sherwani said. If SiFive is ever blocked from such transfers in the future, the company's thinking goes, SiFive China will still be able to serve Chinese customers. SiFive currently has three offices in China, with its headquarters in Shanghai. The company said it will open more Chinese offices as the country pushes ahead with its national goal of semiconductor independence. SiFive told the Nikkei Asian Review that it will announce a 5G chip based on the RISC-V architecture in the near future. Although the company may not be able to export the chips directly to China, most of their design could be transferred to SiFive China, and the local team trained to build the chips within the country, SiFive said. China has some of the best universities in the world and is producing some of the best PhDs. There are obviously a lot of smart people living there, and it's a question of hiring them, training them, putting them in the structure and getting the work done," Sherwani said. His optimism stands in contrast to the downbeat mood among chip industry insiders in China, who say that without continued access to cutting-edge U.S. technology, local chip development will "hit a wall." Sherwani, however, is confident that SiFive China -- which registered as an independent company under the name Shanghai SaiFang Technology Co. in 2018 -- will be able to stand on its own. The company said all executives at SiFive China are Chinese nationals and are familiar with the local market. "It's a 100% Chinese company," Sherwani said. "We set it up this way so that our U.S. operation will not impact China, and vice versa." Earlier this month SiFive raised $65.4 million in a Series D funding round from existing backers such as Sutter Hill Ventures and Chengwei Capital, and new investor Qualcomm. SiFive has also previously received investment from Intel, Samsung and Western Digital and has raised a total of more than $125 million since 2016. Raja Koduri, general manager of edge computing solutions and chief architect at Intel, praised the startup's technology. "SiFive's cloud-based SaaS [software as a service] approach provides another level of flexibility and ease for design teams." The startup says it currently has more than 100 licenses for its RISC-V processors, and said six of the top 10 semiconductor companies, including Qualcomm and SK Hynix, are among its customers. SiFive-designed chips have been used in commercially released products, including a smartwatch made by Chinese wearable device company Huami and a storage device by South Korean startup Fadu. While SiFive does not have any exposure to Huawei, the company said it is open to the possibilities of working together through SiFive China. Huawei declined to comment for this article. Not everyone is confident that RISC-V will be able to fill Arm's shoes in China, however. "RISC-V is new and might not be ready yet, especially for the 5G phones," said Neil Shah, research director at Counterpoint, an Asia-based technology analysis company. But Sherwani believes RISC-V will soon catch up. "It took Arm 25 years to get here. RISC-V started in 2010, but it was just an academic project and didn't really start in full speed until three years ago," he said. "And in three years, RISC-V has got close to the Arm v8 processor, and we think we will be on equivalent or beyond v8 in about a year." Source
  13. ?! 1/ If this is a giveaway Then it's not the right place for such posts, and we already have it in the right section. 2/ if this is a software update then the "Giveaway" word should be removed from the title. (In both cases the key has activations exceeded) Also, always post direct links to dev site whenever available, which is the case here.
  14. My information does not appear in my profile? I am Logan a student soon you will notice me contributing around hopefully!, I am trying to view others profiles but i am not able to do that, Sorry again for inconvenience still digging the forum's aspects. I understand that there is guidance for granting the CID and nobody is following them spoonfeeding the users is an awful thing for developments teams and i wish it stops my apologies for any disrespect. Best regards, Logan
  15. Multiple reports have indicated that Apple plans to transition to its own ARM-based processors in Macs starting as early as 2020, and the company recently made a significant hire that lends credence to that objective. ARM's lead CPU and system architect Mike Filippo joined Apple last month, based out of the Austin, Texas area, according to his LinkedIn profile. Filippo led the development of several chips at ARM between 2009 and 2019, including the Cortex-A76, Cortex-A72, Cortex-A57, and upcoming 7nm+ and 5nm chips. Filippo also served as Intel's lead CPU and system architect between 2004 and 2009, and he was a chip designer at AMD between 1996 and 2004, so he brings a wealth of chipmaking experience with him to Apple. Filippo's profile still lists his ARM role as ongoing, but social media talk suggests that he has left the company. Apple designing its own ARM-based processors for Macs would allow it to move away from Intel processors, which have frequently faced delays. In fact, sources within Intel reportedly confirmed to Axios that Apple does plan to transition to ARM-based processors in Macs starting next year. Apple already designs its own A-series chips for the iPhone and the iPad, and it also designs the custom T2 security chip in recent Mac models, as part of its broader efforts to move to in-house components and chip designs. Apple has long been known for closely integrating its hardware and software. Last year, Bloomberg reported that the transition to ARM-based processors is part of a multi-step process that will eventually allow developers to create one app with a single binary that runs across iPhone, iPad, and Mac. Apple has already laid the groundwork for this with Project Catalyst. Update: ARM has confirmed Filippo's departure in a statement provided to Bloomberg: "Mike was a long-time valuable member of the ARM community. We appreciate all of his efforts and wish him well in his next endeavor." Bloomberg suggests that Filippo's experience could assist Apple with its ARM-based Mac processors. The report also suggests that Filippo could help fill the void left by the departure of Gerard Williams III, the lead designer of Apple's custom iPhone and iPad chips from the A7 to A12X, earlier this year. Source
  16. Today
  17. Good to be here but you never introduced yourself to the forum, did you? You opted to come straight here and ask us to help you, that is not fair please
  18. Samsung will reportedly release a new Galaxy phone that you can fold in half, like the rumored Motorola Razr. Rather than trying to make another tablet like the troubled Galaxy Fold, the company wants to make a device that's more convenient to carry your phone around. Reported by the Korean publication ET News — which is consistently accurate — the foldable phone will start production as soon as November of this year and will launch in the first half of 2020. The Razr-like Samsung clamshell will allegedly use a 6.7-inch screen just like the Galaxy S10 5G. It would vertically fold in half right in the middle, so you can easily fit it in your jeans or throw it in your bag. Not only is it a more convenient format to carry around but it will also automatically protect the screen against scratches in a purse. Like the old Razr — and apparently the incoming foldable Razr, seen above — the Samsung Galaxy foldable clamshell will have an external 1-inch screen for notifications, so you don’t have to open the phone every time a message or a news alert pops up. According to ET News, Samsung remains committed to the foldable phone. Rather than dialling back, they are ready to double down with this new format, which apparently has many executives really excited. As Samsung Mobile CEO DJ Ko said last August, there’s a long-term roadmap for this product line. The report also says that the Galaxy Fold’s design problems will be fixed “soon”. Once that’s done, Samsung will again put its weight behind that model and this new clamshell. I don’t know about you, but almost a third of my 6.39-inch Xiaomi Mi Mix 3 is always popping out of my jeans’ back pocket. The idea of folding it in half to carry it and getting back to normal size at any time with a flip sounds perfect. Source
  19. I need help for CID for a friend who guided me into the forum i am getting service is not available once trying to get it 2019 W8HQD Sorry for troubles... 6117601 0163652 4267575 9038960 2354214 2772136 8416670 9016114 7475365
  20. Siddharta

    MusicBee 3.3.7115 

    MusicBee 3.3.7115 MusicBee makes it easy to manage, find, and play music files on your computer. MusicBee also supports podcasts, web radio stations and SoundCloud integration. - Use auto-tagging to clean up your messy music library - Skins are a great way to personalize MusicBee to your liking - Sync your music collection with devices you use - MusicBee has native support for Groove Music (formerly Xbox Music) - Very lightweight music player Homepage Release notes Version 3.3.7115 For Win7/ Win8/ Win10 Released on June 26, 2019 Official download links: http://www.mediafire.com/file/d5t19v98b547hkk/MusicBeeSetup_3_3.zip/file Mirror 1: https://www.majorgeeks.com/files/details/musicbee.html Portable: https://www.mediafire.com/file/ncbf9q7ieo36nxc/MusicBeePortable_3_3.zip/file
  21. We finally have confirmed launch dates for the GeForce RTX Super series. CONFIRMED: RTX SUPER to be announced on July 2nd NVIDIA has confirmed announcement and launch dates for GeForce RTX Super series to the press. All their SKUs will be made public on July 2nd. This is the embargo on the news for all three cards. When it comes to reviews only 2070S and 2060S embargo will lift on the same day. The RTX 2080 SUPER review embargo has not been decided yet by NVIDIA (officially it’s TBD — or ‘later in July’). The information from NVIDIA does not confirm if SUPER series will be available on the same day as reviews (hard launch / on-shelf date). Custom cards need to wait, because, why not Interestingly, NVIDIA has decided to postpone the review embargo for custom cards to July 9th. It should be said as it is, it is a very bad decision, which will affect the sales of AIC cards. The criticism is justified and we are probably the only site that can tell you this right now (because everyone else is under embargo). It is not only anti-consumer, whose opinion will be based on Founders Edition cards only, but also anti-partner behavior It is worth noting that the dates were correctly predicted by Usman Pirzada from Wccftech. The only part that cannot be confirmed at the time is July 23rd for RTX 2080 SUPER. Source
  22. SK hynix Inc. announced today that it has developed and started mass-producing the world's first 128-Layer 1 Tb (Terabit) TLC (Triple-Level Cell) 4D NAND Flash, only eight months after the Company announced the 96-Layer 4D NAND Flash last year. The 128-Layer 1 Tb NAND chip offers the industry's highest vertical stacking with more than 360 billion NAND cells, each of which stores 3 bits, per one chip. To achieve this, SK hynix applied innovative technologies, such as "ultra-homogeneous vertical etching technology," "high-reliability multi-layer thin-film cell formation technology," and ultra-fast low-power circuit design, to its own 4D NAND technology. The new product provides the industry's highest density of 1 Tb for TLC NAND Flash. A number of companies including SK hynix have developed 1 Tb QLC (Quad-Level Cell) NAND products, but SK hynix is the first to commercialize the 1 Tb TLC NAND Flash. TLC accounts for more than 85% of the NAND Flash market with excellent performance and reliability. The small chip size, the biggest advantage of the Company's 4D NAND, allowed SK hynix to realize ultra-high-density NAND Flash memory. The Company announced the innovative 4D NAND in October 2018, which combined 3D CTF (Charge Trap Flash) design with the PUC (Peri. Under Cell) technology. With the same 4D platform and process optimization, SK hynix was able to reduce the total number of manufacturing processes by 5% while stacking 32 more layers on the existing 96-Layer NAND. As a result, the investment cost for the transition from 96-Layer to 128-Layer NAND has been reduced by 60% compared to the previous technology migration, significantly boosting investment efficiency. The 128-Layer 1 Tb 4D NAND increases bit productivity per wafer by 40% compared to the Company's 96-Layer 4D NAND. SK Hynix will start shipping the 128-Layer 4D NAND flash from the second half of this year, while continuing to roll out various solutions. With its four-Plane architecture in a single chip, this product achieved a data transfer rate of 1,400 Mbps (Megabits/sec) at 1.2 V, enabling high-performance and low-power mobile solutions and enterprise SSD. SK Hynix plans to develop the next-generation UFS 3.1 product in the first half of next year for major flagship smartphone customers. With 128-Layer 1 Tb NAND Flash, the number of NAND chips necessary for a 1 TB (Terabyte) product, currently the largest capacity for a smart phone, will be reduced by half, compared to 512 Gb NAND; it will provide customers with a mobile solution with 20% less power consumption in a 1 mm-thin package. The Company also intends to start mass production of a 2 TB client SSD with an in-house controller and software in the first half of next year. 16 TB and 32 TB Non-Volatile Memory express (NVMe) SSDs for cloud data centers will be released next year as well. "SK Hynix has secured the fundamental competitiveness of its NAND business with this 128-Layer 4D NAND," said Executive Vice President Jong Hoon Oh, Head of Global Sales & Marketing. "With this product, with the industry's best stacking and density, we will provide customers with a variety of solutions at the right time." SK Hynix is developing the next-generation 176-Layer 4D NAND Flash, and will continue to strengthen the competitiveness of its NAND business through technological advantages. Source
  23. cosy

    CHAT ABOUT OFFICE ACTIVATION

    Yes please do so There are some keys which are posted from now and on, they don't last long (most are already "dead2 before they are posted), but you may be lucky to get one which can activate your product. It is not a must, sometimes one can get the CID (if you do the activation offline) from the web page or post your IID and we or some other members help you to get it activated you are almost there, so don't lose hope
  24. Link still working here
  25. Before fire, Philadelphia refinery scaled back big maintenance project: sources (Reuters) - Philadelphia Energy Solutions dramatically scaled back a large maintenance project in January in the same section of the refinery complex where a massive explosion occurred last week, according to three sources familiar with the plant’s operations. FILE PHOTO: A massive fire burns at Philadelphia Energy Solutions Inc's oil refinery in this still image from video in Philadelphia, Pennsylvania, U.S. June 21, 2019. WCAU-TV/NBC via REUTERS/File Photo The $130 million capital project, once hailed as one of the largest in the history of the plant, was slated for the Girard Point section of the 335,000 barrel-per-day refinery complex and scaled back due to lack of money, the sources said. Late Tuesday, sources familiar with the company’s plans said the refinery, the largest and oldest on the U.S. East Coast, would be shut indefinitely. Philadelphia Mayor Jim Kenney confirmed that on Wednesday. The cause of the explosion remains unknown, but officials expect investigators to look at the decision to scale back the maintenance project and see whether it played a role. “It is definitely a concern and I would expect investigators to look into it,” Philadelphia Mayor James Kenney said in a brief interview on Tuesday that followed a news conference on the explosion. Planned capital projects, called turnarounds, are a core part of the refining business and help prevent against unexpected shutdowns and accidents. The work includes replacing valves, cleaning out units, replacing catalysts and other work that is typically scheduled and planned years in advance. PES did not respond to requests for comment. The company is seeking to close the refinery permanently, after years of financial struggles that forced benefit cuts and layoffs. Friday’s blaze resulted in a series of explosions that sent a fireball into the sky and completely destroyed an alkylation unit that uses hydrofluoric acid in the refining process, a chemical that can harm or kill people with too much exposure. In mid-January, Philadelphia Energy Solutions manager of capital projects, Jim Demes, convened heads of the city’s building trades unions for lunch at a South Philadelphia eatery to tell them the $130 million plan, expected to start less than a week later, needed to be scaled back significantly. He told the union leaders at that session that the unions should send home workers brought in from out of town for the project that had been slated to be the largest in the refinery’s history. The reason, Demes told the group, was the company was running out of money, according to two sources familiar with the discussions. “Projects get scaled back. That’s not uncommon. But to do it just days before it was about to begin never happens. These things get planned years in advance, so I think investigators are going to look at the decision-making process,” said one building trade source. Ultimately, the refinery did shut its 200,000-bpd crude unit at the Girard Point section for maintenance in January, but the scope of the work was narrowed. It restarted its crude unit in late February, and later restarted a gasoline-making unit in March. The Philadelphia refinery is the largest refinery by capacity on the East Coast, crucial to the U.S. Northeast’s gasoline supply. Pictures on Tuesday showed workers recovering charred sections of the refinery, and the blast threw pieces of tanks and other material onto nearby highways. Source: Before fire, Philadelphia refinery scaled back big maintenance project: sources
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